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Product Detailed Parameters
- Description：IGBT MOD 600V 750A INT-A-PAK
- Series：-
- Mfr：Vishay General Semiconductor - Diodes Division
- Package：Bulk
- IGBT Type：-
- Configuration：Half Bridge
- Vce(on) (Max) @ Vge, Ic：1.52V @ 15V, 400A
- Input：Standard
- NTC Thermistor：No
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：Dual INT-A-PAK (3 + 8)
- Supplier Device Package：Dual INT-A-PAK
- Voltage - Collector Emitter Breakdown (Max)：600 V
- Current - Collector (Ic) (Max)：750 A
- Power - Max：1563 W
- Current - Collector Cutoff (Max)：1 mA
- Input Capacitance (Cies) @ Vce：-
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Overview
The VS-GA400TD60S is a half-bridge IGBT module utilizing Gen 4 technology, rated for 600 V and 750 A. It features an INT-A-PAK chassis mount package with integrated HEXFRED antiparallel diodes characterized by ultrasoft reverse recovery. The module is optimized for hard switching speed and low VCE(on), offering a square RBSOA for robust operation in high-power industrial applications.
Feature Summary
- Integrates Gen 4 IGBTs with optimized hard switching performance
- Includes HEXFRED antiparallel diodes with ultrasoft reverse recovery characteristics
- Designed for chassis mounting in high-current power conversion systems
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- High-frequency induction heating
Procurement Notes
Verify the specific suffix against official Vishay documentation to confirm exact electrical tolerances and packaging configuration. Ensure compatibility with required thermal interface materials and mounting hardware for the INT-A-PAK form factor before procurement.
Selection Notes
Select this module for applications requiring high current capacity and fast switching speeds. Consider the thermal management requirements associated with the INT-A-PAK package and ensure the system design supports the specified voltage and current ratings for reliable operation.
Part Context
This component belongs to Vishay's high-power IGBT module lineup, designed for demanding power electronics environments. It represents an evolution in silicon technology aimed at improving efficiency and switching performance compared to previous generations of discrete or module-based solutions.
Replacement Considerations
Consult official substitution lists for compatible modules with matching voltage, current, and package specifications. Verify pinout and thermal interface compatibility when considering alternative manufacturers or series.
