SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The VSRAM-04-50-50-00-G is a rectangular military specification connector from the AirBorn Versi series, manufactured by Molex. It functions as a plug with 200 positions arranged in four rows and fifty columns. The component utilizes male pin contacts with gold plating and employs a press-fit termination method for board mounting. Designed to MIL-DTL-83513 standards, it features a plastic body and operates within a temperature range of -55°C to +125°C.
Verify the specific suffix 'G' against the manufacturer's current datasheet to confirm material composition and environmental compliance status. Ensure that the press-fit termination requirement matches the target printed circuit board design specifications before procurement.
Select this component when a 200-position high-density interconnect is required for vertical board mounting. The choice depends on the necessity for MIL-DTL-83513 compliance and the preference for press-fit termination over traditional soldering methods in high-vibration environments.
This part belongs to the AirBorn Versi family of connectors, which are engineered for demanding environments. The series offers various configurations including receptacles and plugs with different row counts and termination styles, all adhering to strict military reliability standards.
Direct substitutes must match the 200-position count, 4-row layout, and press-fit termination. Verify compatibility with existing MIL-DTL-83513 housing dimensions and contact spacing.

WILMINGTON, Mass. – July 3, 2026 – Analog Devices, Inc. (ADI), the global leading supplier of high-performance analog, mixed-signal and signal processing semiconductors, has…
Read MoreRecently, global semiconductor manufacturers have been constantly making moves in aspects such as technological cooperation, product manufacturing processes, and market layout, demonstrating the rapid…
Read MoreSeptember 16, 2026 – Global — Leading semiconductor manufacturer ON Semiconductor (onsemi, NASDAQ: ON) has officially issued a formal price adjustment letter to global…
Read More
The rapid advancement of artificial intelligence (AI) is transforming industries across the globe, and the world of electronic components is no exception. From smarter…
Read MoreSANTA CLARA, Calif. — Leading semiconductor solution provider Marvell Technology (NASDAQ: MRVL) officially rolled out a selective price adjustment for its core electronic component…
Read More
On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
Read More
Select MOV varistors by continuous voltage, clamping behavior, surge waveform and repetition. Check thermal disconnection, fuse coordination and replacements.
Read More
Understand RF attenuator dB values, fixed and programmable types, impedance, power limits and noise tradeoffs before choosing parts for an RF signal path.
Read MoreMay 8, 2026 – Eindhoven, Netherlands NXP Semiconductors (NXPI), a global leader in automotive and industrial semiconductor solutions, has officially notified its worldwide channel…
Read More
Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
Read More
Embedded Integrated Circuit Modules: The Backbone of Modern Technology Embedded Integrated Circuit Modules (EICMs) have become an indispensable part of modern technology. Serving as…
Read More
In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
Read More