Memory IC W634GU6QB09I TR product image

W634GU6QB09I TR

  • Description:IC DRAM 4GBIT PAR 96VFBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tape & Reel (TR)

SKU:c1af8b63d8ef Category: Brand:

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W634GU6QB09I TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC DRAM 4GBIT PAR 96VFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W634GU6QB09I TR

  • Description:IC DRAM 4GBIT PAR 96VFBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR3L
  • Memory Size:4Gbit
  • Memory Organization:256M x 16
  • Memory Interface:Parallel
  • Clock Frequency:1.06 GHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.283V ~ 1.45V
  • Operating Temperature:-40°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:96-VFBGA
  • Supplier Device Package:96-VFBGA (7.5x13)
  • Access Time:20 ns

Memory IC datasheet and documents for W634GU6QB09I TR

W634GU6QB09I TR

Memory IC Overview

The W634GU6QB09I TR is a 4Gbit DDR3L SDRAM organized as 32M x 16 with eight internal banks. It supports a maximum operating frequency of 1066 MHz and operates within a voltage range of 1.283V to 1.45V, with backward compatibility to 1.5V. The device features an industrial temperature rating from -40°C to 95°C and utilizes a 96-ball VFBGA package.

Memory IC Feature Summary

  • Supports double data rate architecture with two data transfers per clock cycle for high-speed performance.
  • Includes programmable on-die termination (ODT) and dynamic ODT modes to improve signal integrity.
  • Features write leveling and Multi Purpose Register (MPR) support for system-level timing calibration.

Memory IC Applications

  • High-performance computing systems requiring low power consumption
  • Industrial embedded applications needing extended temperature stability
  • Portable devices utilizing mobile memory architectures

Memory IC Procurement Notes

Verify the specific speed grade suffix '09I' against official Winbond documentation to confirm the -40°C to 95°C industrial temperature range. Ensure the reel packaging matches the 'TR' designation in the part number. Cross-reference the RoHS compliance status and moisture sensitivity level prior to procurement.

Memory IC Selection Notes

Select this component when a 16-bit interface width is required for 4Gbit capacity. The industrial temperature grade ensures reliability in harsh environments. Consider the 1066 MHz maximum frequency for bandwidth requirements. Verify that the host system supports DDR3L voltage levels and differential clock inputs.

Memory IC Part Context

This device belongs to the W634GU6QB series of DDR3L SDRAMs manufactured by Winbond Electronics. The series offers various speed grades and temperature ranges, with the '09I' variant specifically designed for industrial applications. It shares architectural similarities with other DDR3L parts but is distinct in its 16-bit organization and 96-ball package configuration.

Memory IC Replacement Considerations

W634GU6QB-09

Memory IC FAQ

What is the maximum operating frequency for the W634GU6QB09I?

The maximum operating frequency is 1066 MHz, corresponding to the DDR3L-2133 speed grade.

Does the W634GU6QB09I support 1.5V operation?

Yes, it is backward compatible with 1.5V operation, although it is optimized for 1.35V DDR3L standards.

W634GU6QB09I TRW634GU6QB09I TR

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