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The WAS175M12BM3 is a silicon carbide half-bridge module rated for 1200 V and 175 A. It features an industry-standard 62 mm footprint with a copper baseplate and aluminum nitride insulator. Key electrical parameters include a drain-source breakdown voltage of 1200 V, a typical on-state resistance of 10.4 mΩ at 25°C, and a forward voltage of 1.8 V for the integrated diode. The device supports a maximum junction temperature of 175°C and operates within a case temperature range of -40°C to 125°C.
Verify the specific ordering suffix when purchasing. The WAS175M12BM3 designation indicates the module without pre-applied phase change thermal interface material. Confirm that the required thermal management solution is sourced separately to ensure proper heat dissipation during installation.
Select this component based on its 1200 V blocking capability and 175 A continuous current rating. Ensure the design accommodates the recommended gate voltage of -4 V to +15 V. Verify that the application's stray inductance requirements align with the module's internal characteristics for optimal switching performance.
This part belongs to the BM3 family of Wolfspeed silicon carbide modules. It utilizes a dual configuration housed in a screw-mount package. The module integrates both N-channel MOSFETs and Schottky diodes into a single compact unit optimized for industrial power electronics applications.
Publicly confirmed substitute part numbers are not available in the provided documentation. Designers should verify pin compatibility and thermal resistance specifications before considering alternative components from other manufacturers.
No, the WAS175M12BM3 does not include pre-applied phase change thermal interface material. The variant with pre-applied material is designated as WAS175M12BM3T.
The maximum transient gate-source voltage (VGS(max)) is specified as -10 V to +23 V.
The integrated diodes exhibit zero reverse recovery, which contributes to ultra-low loss and high-frequency operation capabilities.