WAS300M12BM2

Overview

The WAS300M12BM2 is a Silicon Carbide (SiC) MOSFET power module manufactured by Wolfspeed, Inc. It features a half-bridge configuration with two N-channel devices housed in a BM2 screw-terminal module package. The component supports a drain-source voltage of 1200V and delivers a continuous drain current of 423A at case temperature. Key electrical parameters include a maximum on-resistance of 5.7 milliohms at 300A and 20V gate drive, a typical threshold voltage of 2.3V, and a maximum gate charge of 1025nC at 20V. The module has a maximum power dissipation of 1660W, an input capacitance of 19500pF at 800V, and operates up to a junction temperature of 150°C.

Feature Summary

• Utilizes Silicon Carbide technology for high-voltage operation and thermal stability
• Half-bridge topology integrates two N-channel MOSFETs within a single module
• Designed for baseplate mounting using screw terminals for secure mechanical attachment

Applications

• Industrial motor drives
• Uninterruptible power supplies
• High-frequency DC-DC converters

Procurement Notes

Verify the specific ordering suffix and manufacturing date code against the latest Wolfspeed datasheet before procurement. Confirm that the intended application aligns with the component's industrial qualification status. Ensure that the supply chain source provides valid traceability documentation. Check for any recent product change notices regarding packaging or marking updates.

Selection Notes

Select this module when a compact half-bridge solution with high current capacity is required. Evaluate the thermal management requirements based on the 1660W power dissipation rating and 150°C junction limit. Compare the 5.7 milliohm on-resistance against system efficiency targets. Ensure the gate driver can provide the necessary 20V swing to fully enhance the device.

Part Context

This component belongs to the CAS300 series of SiC power modules from Wolfspeed. It utilizes the standardized BM2 form factor, which facilitates compatibility with existing heatsink designs and PCB layouts common in the industry. The module represents a generation of components optimized for high-power density applications requiring robust switching performance.

Replacement Considerations

Consult official manufacturer documentation for qualified replacement part numbers. Verify pinout compatibility and thermal interface specifications before substituting.