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The XC17S20PD8I is a specialty memory circuit manufactured by Rochester Electronics, functioning as a PROM configuration device. It features a synchronous operation mode and a memory density of 178,144 bits organized as 178,144 words by 1 bit. The component is housed in an 8-pin Plastic Dual In-Line Package (PDIP). It operates within a temperature range of -40°C to +85°C.
Verify the manufacturer designation on the component marking, as Rochester Electronics often distributes components originally designed by other semiconductor manufacturers. Confirm that the PDIP-8 package dimensions match the target PCB footprint requirements. Ensure the operating temperature range meets the specific environmental conditions of the intended deployment scenario before finalizing procurement.
Select this component when a low-density, single-bit wide configuration memory is required for legacy or specific FPGA architectures. The synchronous interface simplifies timing constraints compared to asynchronous alternatives. Consider the physical size of the DIP-8 package against available board space, as surface-mount options may be necessary for high-density designs.
This part belongs to the Xilinx XC17 series of programmable read-only memories, widely used for configuring Xilinx FPGAs. Rochester Electronics provides these parts as a source of supply for discontinued or legacy components, ensuring continuity for existing designs that rely on this specific memory technology and package style.
Check for pin-compatible alternatives with identical memory organization. Verify that any substitute supports the same synchronous protocol and voltage levels. Ensure the replacement maintains the required industrial temperature rating.