XC17V01VO8C

Overview

The XC17V01VO8C is a one-time programmable (OTP) configuration PROM manufactured by AMD. It provides 1Mb of storage capacity for FPGA initialization data. The device is housed in an 8-pin Small Outline Integrated Circuit (SOIC) package, designed for serial interface operations to reliably store configuration bitstreams required for setting up field-programmable gate arrays in electronic systems.

Feature Summary

• One-time programmable memory architecture for permanent data retention
• Dedicated configuration role for Field-Programmable Gate Arrays
• Serial interface operation for efficient data transfer
• Compact surface-mount packaging for space-constrained designs

Applications

• FPGA configuration and initialization
• Embedded system boot code storage
• Industrial control hardware setup
• Communication equipment firmware loading

Procurement Notes

Verify the exact suffix 'O8C' against official AMD documentation to confirm pinout and voltage specifications. Ensure compatibility with the target FPGA's configuration mode requirements before procurement. Cross-reference the manufacturer part number with authorized distributors to avoid counterfeit components. Confirm that the OTP nature of the device aligns with the production volume needs, as reprogramming is not possible after initial programming.

Selection Notes

Select this component when a non-volatile, one-time programmable solution is required for FPGA configuration. Consider the 1Mb density sufficient for the specific FPGA's bitstream size. Evaluate the SOIC package suitability for the PCB assembly process. Verify that the serial interface matches the FPGA's configuration port capabilities. Assess thermal and electrical constraints to ensure reliable operation within the intended environment.

Part Context

This component belongs to AMD's Xilinx configuration PROM family, specifically designed for initializing Xilinx FPGAs. These devices serve as external memory sources that provide the necessary configuration data to the FPGA upon power-up. The series supports various densities and packages to accommodate different design complexity and form factor requirements across embedded and industrial applications.

Replacement Considerations

Consult AMD's official cross-reference guides for verified substitutes. Ensure any replacement maintains identical pinout, voltage levels, and interface timing characteristics. Verify that alternative parts support the same 1Mb capacity and OTP functionality. Confirm package compatibility to avoid PCB redesign efforts.