XCZU19EG-2FFVC1760E

Soc System On Chip Overview

The AMD XCZU19EG-2FFVC1760E is a Zynq UltraScale+ MPSoC EG device manufactured using 20nm FinFET+ technology. It integrates a processing system with a quad-core ARM Cortex-A53 MPCore, dual-core ARM Cortex-R5F, and an ARM Mali-400 MP2 GPU. The programmable logic side provides approximately 1,143K logic cells, including 522,720 LUTs and 1,045,440 flip-flops. Key resources include 1,968 DSP slices, 36.0 Mb of UltraRAM, and 34.6 Mb of Block RAM. The device supports up to 72 high-speed transceivers and operates within a junction temperature range of -40°C to +100°C in the FFVC1760 package.

Soc System On Chip Feature Summary

• Integrated SoC architecture featuring quad-core ARM Cortex-A53 (up to 1.3 GHz), dual-core ARM Cortex-R5F (up to 600 MHz), and ARM Mali-400 MP2 GPU (up to 667 MHz).
• High-performance FPGA fabric with 1,143,450 system logic cells, 1,968 DSP slices, and extensive memory resources including 36.0 Mb UltraRAM and 34.6 Mb Block RAM.
• Supports up to 72 GTH/GTY transceivers for high-speed serial communication protocols such as PCIe Gen3/Gen4, Ethernet, and Aurora.
• Industrial temperature rating (-40°C to +100°C) with speed grade -2 (0.85V VCCINT) for robust operation in demanding environments.

Soc System On Chip Applications

• High-performance real-time signal processing platforms requiring large data buffering and parallel processing capabilities.
• Storage array solutions utilizing VPX architectures with high-throughput interfaces like 100G Ethernet and NVMe SSDs.
• Advanced video processing and visualization systems leveraging the integrated GPU and high-bandwidth memory interfaces.
• Industrial control and automation systems requiring deterministic real-time performance from the Cortex-R5 cores.

Soc System On Chip Procurement Notes

Verify export compliance requirements, as this product may require additional documentation for export from the United States due to its classification under ECCN 5A002A4 XIL. Confirm the specific speed grade and temperature rating matches the design intent, as the -2 suffix indicates industrial temperature range and specific voltage characteristics. Ensure availability of necessary EDA models and constraint files for hardware implementation.

Soc System On Chip Selection Notes

Select this model when high logic density combined with powerful processing cores is required. The XCZU19EG offers a balance of FPGA resources and embedded processing suitable for complex algorithms. Compare against lower-density variants like XCZU17EG if resource usage is lower, or higher-density parts like XCZU19EV if more logic is needed. Ensure the FFVC1760 package size fits the board layout constraints.

Soc System On Chip Part Context

This component belongs to the Zynq UltraScale+ MPSoC EG (Enhanced General) series. It shares the FFVC1760 package footprint with other devices in the family, such as the XCZU17EG and XCZU11EG, allowing for potential pin-compatible upgrades or downgrades within the same package type, though I/O bank configurations may vary between specific part numbers.

Soc System On Chip Replacement Considerations

Direct pin-compatible replacements within the same package include other EG series devices like XCZU17EG-2FFVC1760E or XCZU11EG-2FFVC1760E, provided the logic and memory requirements are met. Verify that the specific I/O banks and transceiver assignments align with the existing design, as these can differ even among package-compatible parts.