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The XP3700MT is a complementary dual MOSFET from the YAGEO XSemi XP series, integrating N-channel and P-channel enhancement-mode transistors in a single PMPAK-8 surface-mount package. It features a drain-source breakdown voltage of 30 V for both channels. The N-channel configuration supports a continuous drain current of 7.3 A with an on-resistance of 18 mΩ, while the P-channel variant handles 11 A with 45 mΩ on-resistance. Gate-source voltage limits are ±20 V. Thermal performance includes a power dissipation rating of 3.57 W, operating reliably between -55°C and +150°C junction temperature.
Verify the specific datasheet revision and electrical parameter tolerances against the manufacturer's official documentation before finalizing design specifications. Confirm that the PMPAK-8 footprint matches the target PCB layout requirements. Ensure thermal management strategies align with the stated 3.57 W power dissipation limit under expected operating conditions.
Select this component when space-constrained designs require matched N-P channel pairs for bridge or half-bridge applications. The 30 V rating suits low-voltage DC-DC converters and motor drivers. Evaluate the trade-off between the N-channel's lower resistance and the P-channel's higher current capacity to ensure balanced performance within the specific circuit topology constraints.
This device belongs to the YAGEO XSemi XP series of silicon MOSFETs. The series offers various configurations including single and dual channels in packages like SOT-23, SOT-89, and PMPAK. The XP3700MT specifically addresses needs for complementary switching in small form factors, distinguishing itself from single-channel variants through its integrated dual-transistor architecture.
The maximum gate-source voltage is limited to ±20 V for both the N-channel and P-channel sections.
Yes, the component is rated for junction temperatures ranging from -55°C to +150°C.