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Product Detailed Parameters
- Description：MOSFET N/P-CH 30V 2.9A/2.1A 8MLP
- Series：-
- Mfr：Diodes Incorporated
- Package：Tape & Reel (TR),Cut Tape (CT),Cut Tape (CT)
- Technology：MOSFET (Metal Oxide)
- Configuration：N and P-Channel
- FET Feature：Logic Level Gate
- Drain to Source Voltage (Vdss)：30V
- Current - Continuous Drain (Id) @ 25°C：2.9A, 2.1A
- Rds On (Max) @ Id, Vgs：120mOhm @ 2.5A, 10V
- Vgs(th) (Max) @ Id：1V @ 250µA (Min)
- Gate Charge (Qg) (Max) @ Vgs：3.9nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds：190pF @ 25V
- Power - Max：1.7W
- Operating Temperature：-
- Mounting Type：Surface Mount
- Package / Case：8-VDFN Exposed Pad
- Supplier Device Package：8-MLP (3x2)
- Grade：-
- Qualification：-
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Overview
The ZXMC3AM832TA is a complementary dual enhancement mode MOSFET array from Diodes Incorporated, packaged in a 3mm x 2mm MLP. It integrates one N-channel and one P-channel device within a single footprint to optimize PCB space. The N-channel unit provides a drain-source voltage of 30V, continuous current of 3.7A, and on-resistance of 0.12Ω at VGS=10V. The P-channel counterpart offers -30V breakdown, -2.7A continuous current, and 0.21Ω on-resistance at VGS=-10V. Both channels feature low gate charge for fast switching.
Feature Summary
- Combines N-channel and P-channel enhancement mode MOSFETs in a compact 3mm x 2mm MLP package
- Optimized for high efficiency and low voltage power management applications
- Features low on-resistance and fast switching speeds for improved circuit performance
Applications
- MOSFET gate drive circuits
- LCD backlight inverters
- Motor control systems
Procurement Notes
Verify component status before procurement as the datasheet explicitly marks this part as not recommended for new designs. Confirm availability through authorized distributors, noting that standard packaging quantities may vary. Ensure compliance with RoHS directives if required by the specific manufacturing environment.
Selection Notes
Select this component only for legacy designs or direct replacements where the 3mm x 2mm MLP footprint is mandatory. For new projects, consider the manufacturer-recommended alternative ZXMC3AMCTA, which shares similar electrical characteristics but utilizes an updated DFN3020B-8 package configuration.
Part Context
This component belongs to the MPPS (Miniature Package Power Solutions) series by Diodes Incorporated. It was originally developed under the Zetex brand before acquisition. The device represents an early iteration of dual MOSFET arrays designed to reduce component count in portable electronics and power management modules.
Replacement Considerations
The datasheet recommends using ZXMC3AMCTA as a replacement. Verify pinout compatibility between the MLP832 and DFN3020B-8 packages during retrofitting. Electrical parameters are comparable, but thermal resistance values differ due to package geometry changes.
