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— IC芯片 | 连接器 | 传感器 | 被动器件 —
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— IC芯片 | 连接器 | 传感器 | 被动器件 —

Devices in the System-on-Chip family combine on one device substrate several computing system components which traditionally would be implemented as separate devices, such as a general-purpose microprocessor, an FPGA co-processor, and a graphics controller for generation of display data. While limited amounts of data storage resources may also be incorporated, the provision of an interface to external storage devices is typical.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
| Broadcom Limited | UNIPROCESSOR SOC | Tray | - | * | - | ||
| Broadcom Limited | UNIPROCESSOR SOC | Tray | - | * | - | ||
| Broadcom Limited | MIP64 UNIPROCESSOR SOC | Bulk | - | * | - | ||
| Broadcom Limited | VOIP PART, 1.25GHZ, 3D, 17X17 FC | Bulk | - | - | - | ||
| Broadcom Limited | DOCSIS EOC WITH ONE A/D SCDMA | Tray | - | * | - | ||
| Broadcom Limited | BCM3349+BCM3409 DOCSIS 2.0 CAB | Tray | - | * | - | ||
| Broadcom Limited | DOCSIS 3.0 DATA MODEM I-TEMP | Tray | - | * | - | ||
| Broadcom Limited | DOCSIS 3.0 VOCM SOC | Tray | - | * | - |

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