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— IC芯片 | 连接器 | 传感器 | 被动器件 —
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— IC芯片 | 连接器 | 传感器 | 被动器件 —

Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() FTCO3V85A1 $31.90 | onsemi | AUTOMOTIVE POWER MODULE | Tube | - | - | ||
| onsemi | MODULE SPM 300V VPM19-BA | Tray | Through Hole | SPM® | |||
![]() FVP18030IM3LSG1 $16.20 | Fairchild Semiconductor | BUFFER/INVERTER PERIPHL DRIVER | Tray | Through Hole | SPM® | ||
![]() GA100SICP12-227 $151.94 | GeneSiC Semiconductor | SIC CO-PACK SJT/RECT 100A 1.2KV | Tube | Chassis Mount | - | ||
![]() GA10SICP12-247 $20.77 | GeneSiC Semiconductor | SIC CO-PACK SJT/RECT 10A 1.2KV | Tube | Through Hole | - | ||
![]() GA20SICP12-263 $30.39 | GeneSiC Semiconductor | SIC CO-PACK SJT/RECT 20A 1.2KV | Tube | Surface Mount | - | ||
![]() GA50SICP12-227 $75.97 | GeneSiC Semiconductor | SIC CO-PACK SJT/RECT 50A 1.2KV | Tube | Chassis Mount | - | ||
![]() IFCM10P60GDXKMA1 $14.83 | Infineon Technologies | IFPS MODULES | Tube | Through Hole | CIPOS™ |

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