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— IC芯片 | 连接器 | 传感器 | 被动器件 —

Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() IFCM10S60GDXKMA1 $11.87 | Infineon Technologies | IFPS MODULES | Tube | Through Hole | CIPOS™ | ||
![]() IFCM15P60GDXKMA1 $12.63 | Infineon Technologies | IFPS MODULE 650V 30A 24PWRDIP | Tube | Through Hole | CIPOS™ | ||
![]() IFCM15S60GDXKMA1 $12.63 | Infineon Technologies | IFPS MODULE 650V 30A 24PWRDIP | Tube | Through Hole | CIPOS™ | ||
![]() IFCM20T65GDXKMA1 $12.88 | Infineon Technologies | IPM IGBT 650V 20A 24PWRDIP MOD | Tube | Through Hole | CIPOS™ | ||
![]() IFCM20U65GDXKMA1 $13.47 | Infineon Technologies | IPM IGBT 650V 20A 24PWRDIP MOD | Tube | Through Hole | CIPOS™ | ||
![]() IFCM30T65GDXKMA1 $13.86 | Infineon Technologies | IPM IGBT 650V 30A 24PWRDIP MOD | Tube | Through Hole | CIPOS™ | ||
![]() IFCM30U65GDXKMA1 $14.45 | Infineon Technologies | IPM IGBT 650V 30A 24PWRDIP MOD | Tube | Through Hole | CIPOS™ | ||
![]() IFF2400P17LE4BPSA1 $2,188.17 | Infineon Technologies | IGBT MODULE 1700V IPM MIPAQP-4 | Bulk,Tray | - | - |