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— IC芯片 | 连接器 | 传感器 | 被动器件 —
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— IC芯片 | 连接器 | 传感器 | 被动器件 —

Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() IGCM20F60GAXKMA1 $11.96 | Infineon Technologies | IGBT 600V 20A 24PWRDIP MOD | Tube | Through Hole | CIPOS™ | ||
| Infineon Technologies | IGBT 600V 24MDIP | Tube | Through Hole | CIPOS™ | |||
![]() IGI60L5050B1MXUMA1 $1.16 | Infineon Technologies | HV IGAN/SIPS/MONOLITH | Tape & Reel (TR) | - | - | ||
![]() IGI65D1414A3MSXUMA1 $2.96 | Infineon Technologies | HV IGAN/SIPS/MONOLITH | Tape & Reel (TR) | - | - | ||
| Infineon Technologies | POWER DRVR MOD 600V 10A 24PWRDIP | Tube | Through Hole | CIPOS™ | |||
| Infineon Technologies | IFPS MODULES | Tube | Through Hole | CIPOS™ | |||
![]() IKCM10H60GAXKMA1 $8.38 | Infineon Technologies | MODULE IGBT 600V 10A 24PWRDIP | Tube | Through Hole | CIPOS™ | ||
![]() IKCM10H60HAXKMA1 $5.48 | Infineon Technologies | IFPS MODULES 24MDIP | Bulk,Tube | Through Hole | CIPOS™ |

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