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— IC芯片 | 连接器 | 传感器 | 被动器件 —
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— IC芯片 | 连接器 | 传感器 | 被动器件 —

Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() IKCM20R60GDXKMA1 $14.63 | Infineon Technologies | IFPS MODULE 600V 20A 24PWRDIP | Tube | Through Hole | CIPOS™ | ||
![]() IKCM30F60GAXKMA1 $11.70 | Infineon Technologies | IFPS MODULE 600V 30A 24PWRDIP | Tube | Through Hole | CIPOS™ | ||
![]() IKCM30F60GDXKMA1 $16.28 | Infineon Technologies | IFPS MODULE 600V 30A 24PWRDIP | Tube | Through Hole | CIPOS™ | ||
![]() IKCM30F60HAXKMA1 $8.14 | Infineon Technologies | IFPS MODULES 24MDIP | Bulk,Tube | Through Hole | CIPOS™ | ||
| Infineon Technologies | IFPS MODULES 24MDIP | Tube | Through Hole | CIPOS™ | |||
![]() IKCS12G60DABKMA1 $42.97 | Infineon Technologies | INTELLIGENT POWER MODULE (IPM) | Bulk | - | - | ||
![]() IM06B15AC1SXKMA1 $6.16 | Infineon Technologies | CIPOS MINI | Tube | - | - | ||
![]() IM06B15AC1XKMA1 $8.70 | Infineon Technologies | IM06B15AC1XKMA1 | Tray | - | - |

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