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— IC芯片 | 连接器 | 传感器 | 被动器件 —
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— IC芯片 | 连接器 | 传感器 | 被动器件 —

Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() IM06B20AC1SXKMA1 $7.51 | Infineon Technologies | CIPOS MINI | Tube | - | - | ||
![]() IM06B20AC1XKMA1 $7.12 | Infineon Technologies | IM06B20AC1XKMA1 | Tray | Through Hole | CIPOS™ | ||
![]() IM06B30AC1SXKMA1 $8.85 | Infineon Technologies | CIPOS MINI | Tube | - | - | ||
![]() IM06B30AC1XKMA1 $8.39 | Infineon Technologies | IM06B30AC1XKMA1 | Tray | Through Hole | CIPOS™ | ||
![]() IM06B50GC1XKMA1 $14.99 | Infineon Technologies | CIPOS MINI | Tube | - | - | ||
![]() IM111X3Q1BAUMA1 $8.16 | Infineon Technologies | CIPOS NANO PG-IQFN-37 | Tape & Reel (TR),Cut Tape (CT),Bulk | Surface Mount | CIPOS™ | ||
![]() IM111X6Q1BAUMA1 $9.19 | Infineon Technologies | CIPOS NANO PG-IQFN-37 | Tape & Reel (TR),Cut Tape (CT) | Surface Mount | CIPOS™ | ||
![]() IM12B10CC1XKMA1 $30.02 | Infineon Technologies | IM12B10CC1XKMA1 | Tube | Through Hole | CIPOS™ |

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