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— IC芯片 | 连接器 | 传感器 | 被动器件 —
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— IC芯片 | 连接器 | 传感器 | 被动器件 —

Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() IM12B15CC1XKMA1 $33.07 | Infineon Technologies | IM12B15CC1XKMA1 | Tube | Through Hole | CIPOS™ | ||
![]() IM12B20EC1XKMA1 $37.63 | Infineon Technologies | IM12B20EC1XKMA1 | Tube | Through Hole | CIPOS™ | ||
![]() IM12S60EA2XKMA1 $32.84 | Infineon Technologies | CIPOS MAXI | Tube | - | - | ||
![]() IM12S90EA2XKMA1 $28.42 | Infineon Technologies | CIPOS MAXI | Tube | - | - | ||
![]() IM240M6Y1BAKMA1 $7.28 | Infineon Technologies | IPM MICRO 3PH DRIVER DIP23 | Bulk,Tube | Through Hole | IM240-M6, CIPOS™ | ||
![]() IM240M6Y1BAKSA1 $4.82 | Infineon Technologies | MODULE IPM 3PHASE 23DIP | Tube | Through Hole | IM240-M6, CIPOS™ | ||
![]() IM240M6Y2BAKMA1 $7.28 | Infineon Technologies | MODULE IGBT 600V 4A 23PWRDIP | Bulk | Through Hole | IM240-M6, CIPOS™ | ||
![]() IM240M6Y2BAKSA1 $4.82 | Infineon Technologies | MODULE IPM 3PHASE DIP23A | Tube | Through Hole | IM240-M6, CIPOS™ |

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