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— IC芯片 | 连接器 | 传感器 | 被动器件 —
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— IC芯片 | 连接器 | 传感器 | 被动器件 —

Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() IM240M6Z1BALSA1 $7.48 | Infineon Technologies | MODULE IPM 3PHASE SOP23 | Tube | Surface Mount | IM240-M6, CIPOS™ | ||
| Infineon Technologies | CIPOS MICRO | Tube | Through Hole | CIPOS™ | |||
| Infineon Technologies | MODULE IGBT 600V 3A 23PWRSMD | Tube | Surface Mount | CIPOS™ | |||
![]() IM240S6Z1BALSA1 $4.51 | Infineon Technologies | MODULE IPM 3PHASE SOP23 | Tube | Surface Mount | IM240-M6 | ||
![]() IM241L6S1BALMA1 $8.12 | Infineon Technologies | CIPOS MICRO | Tube | Surface Mount | CIPOS™ | ||
![]() IM241L6T2B2AKMA1 $5.13 | Infineon Technologies | CIPOS MICRO | Tube | - | - | ||
![]() IM241M6S1BALMA1 $7.30 | Infineon Technologies | CIPOS MICRO | Tube | Surface Mount | CIPOS™ | ||
![]() IM241M6S1BAUMA1 $7.30 | Infineon Technologies | CIPOS MICRO PG-SOP-23 | Tape & Reel (TR),Cut Tape (CT) | Surface Mount | CIPOS™ |

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