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1N3163R is listed in the Single Diodes range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is DIODE STD REV 150V 240A DO205AB. Review the specifications below when checking this part for your BOM.
The 1N3163R is a standard recovery rectifier diode manufactured by Microchip Technology. It features a maximum DC reverse voltage of 150 V and an average forward current rating of 240 A. The device exhibits a forward voltage drop of 1.25 V at the rated current and a reverse leakage current of 75 µA at 150 V. Designed for through-hole mounting, it utilizes the DO-205AB (DO-9) axial leaded package. The component operates within a junction temperature range of -65°C to +200°C.
Verify the specific suffix 'R' against the official Microchip datasheet to confirm if it denotes a distinct packaging variant or tape-and-reel configuration compared to the standard 1N3163. Confirm RoHS compliance status as documentation indicates potential non-compliance for the base series. Validate that the DO-205AB package dimensions match the design requirements before finalizing procurement.
Select this component when high surge current capacity and wide operating temperature ranges are required. Ensure the circuit design accommodates the 1.25 V forward voltage drop to manage power dissipation effectively. Verify that the PCB layout supports the mechanical stress of the axial leaded package in high-vibration environments typical of industrial machinery.
This part belongs to the 1N316x series of high-power rectifiers produced by Microchip Technology. These devices are engineered for demanding applications requiring robust performance under high current loads. The series provides a balance of high voltage blocking capability and substantial current carrying capacity in a traditional axial package format.
Consult the official Microchip datasheet for the 1N316x series to identify qualified cross-reference parts. Verify that any substitute matches the 240 A current rating, 150 V reverse voltage, and DO-205AB package footprint to ensure mechanical and electrical compatibility.
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