24LC32AT-E/MNY

Memory IC Overview

The Microchip Technology 24LC32AT-E/MNY is a 32-Kbit Electrically Erasable PROM organized as 4K x 8-bit memory. It operates on a single supply voltage ranging from 2.5V to 5.5V with a maximum clock frequency of 400 kHz. The device features a two-wire I2C compatible serial interface, Schmitt trigger inputs for noise suppression, and hardware write protection via the WP pin. It supports page writes up to 32 bytes and includes an internal address pointer for sequential operations.

Memory IC Feature Summary

• I2C Compatible Two-Wire Serial Interface
• Hardware Write-Protect Capability
• Schmitt Trigger Inputs for Noise Suppression
• Page Write Buffer Support

Memory IC Applications

• Data acquisition systems
• Personal communications devices
• Industrial control applications

Memory IC Procurement Notes

Verify the specific package variant MNY corresponds to the required surface mount footprint. Confirm the Extended temperature range (E) rating matches environmental requirements. Ensure the 2.5V minimum operating voltage aligns with system power rails. Check RoHS compliance status if mandated by project specifications.

Memory IC Selection Notes

Select this component when extended industrial temperature operation is required alongside standard I2C connectivity. The 2.5V minimum voltage requirement distinguishes it from lower-voltage variants. Consider the 32-byte page buffer size for write efficiency. Verify physical package dimensions against PCB layout constraints before finalizing the design.

Memory IC Part Context

This part belongs to the 24XX32A family of 32-Kbit serial EEPROMs. It shares architectural similarities with the 24AA32A but differs in minimum operating voltage specifications. The family utilizes a common block diagram and bus protocol structure across various package options including DFN, MSOP, and TDFN formats.

Memory IC Replacement Considerations

The 24LC32A-I/MNY serves as the Industrial temperature range equivalent. Cross-reference with other 24LC32A variants in different packages such as SOIC or PDIP if form factor changes are permissible.