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The 2N6661 is an N-Channel, Enhancement-Mode Vertical DMOS FET manufactured by Microchip Technology. It features a drain-to-source breakdown voltage of 90V and a maximum gate-to-source voltage of ±20V. The device exhibits a static drain-to-source on-state resistance of 4.0Ω at VGS=10V and ID=1.0A, with a continuous on-state drain current of 1.5A. Operating temperatures range from -55°C to +150°C. Key AC parameters include an input capacitance of 50pF and forward transconductance of 170mmho.
Verify the specific package type and environmental compliance status against the manufacturer's ordering information system before procurement. Confirm that the TO-39 lead-free/ROHS-compliant designation matches project requirements. Ensure all absolute maximum ratings are respected during design validation to prevent permanent damage or reliability degradation over the specified operating temperature range.
Select this component for applications requiring vertical DMOS structure benefits such as thermal stability and ease of paralleling. Consider the 90V breakdown voltage and 4.0Ω on-resistance for appropriate load matching. Evaluate the fast switching characteristics and low input capacitance for high-frequency performance needs. Verify compatibility with existing driver circuits given the enhancement-mode operation and gate threshold specifications.
The 2N6661 belongs to the family of N-Channel, Enhancement-Mode Vertical DMOS FETs produced by Microchip Technology. It utilizes a silicon-gate manufacturing process to achieve power-handling capabilities comparable to bipolar transistors while maintaining MOS-specific advantages like high input impedance. The device is designed for switching and amplifying applications where low threshold voltage and high breakdown voltage are critical.
No public confirmed substitute part numbers are documented in the provided datasheet.
The typical turn-on time (t(ON)) is 10ns under test conditions of VDD=25V, ID=1.0A, and RGEN=25Ω.
Yes, the device features an integral source-drain diode with a reverse recovery time of 350ns at ISD=1.0A.