3-2842287-6

Headers, Male Pins Overview

The 3-2842287-6 is a 36-position, double-row header connector from the AMPMODU series by TE Connectivity. It features a 2mm pitch and through-hole mounting for board-to-board or cable applications. The contacts are gold-plated with a thickness of 0.38µin (1.00µm) to ensure reliable signal transmission. Designed for robust performance, it operates within a temperature range of -55°C to 105°C and meets UL94 V-0 flammability standards.

Headers, Male Pins Feature Summary

• Double-row configuration providing high-density interconnect capability
• Gold-plated contacts for enhanced corrosion resistance and conductivity
• Through-hole termination for secure PCB attachment

Headers, Male Pins Applications

• Board-to-board connections in industrial equipment
• Signal transmission in consumer electronics
• Interfacing modules in telecommunications hardware

Headers, Male Pins Procurement Notes

Verify the specific contact plating thickness and material composition against the official datasheet before integration. Confirm that the through-hole footprint matches the target PCB design guidelines. Ensure compliance with RoHS directives if required for the final assembly environment.

Headers, Male Pins Selection Notes

Select this component when a 2mm pitch double-row header is required for rigid board connections. Consider the gold plating for environments where oxidation resistance is critical. Evaluate the 36-position count against available space constraints on the circuit board layout.

Headers, Male Pins Part Context

This part belongs to the AMPMODU series, a widely used line of rectangular connectors known for reliability in harsh environments. The series offers various configurations including single and double rows with different pin counts and termination styles, supporting diverse electronic interconnection needs.

Headers, Male Pins Replacement Considerations

Check for direct substitutes within the same AMPMODU family with identical 2mm pitch and 36-position count. Verify compatibility of mating connectors and PCB footprints before swapping.