305-052-500-204

Edgeboard Connectors Overview

The EDAC Inc. 305-052-500-204 is a standard card edge connector header featuring 52 positions arranged in a dual-row configuration. It utilizes a 3.96 mm (0.156 inch) contact spacing with a 3.56 mm row spacing. Designed for panel mount installation at a vertical angle, the unit accepts printed circuit boards with a nominal thickness of 1.57 mm (0.062 inch). The contacts are constructed from copper alloy and finished with gold plating to ensure reliable conductivity. Termination is achieved via solder eyelets, providing a secure mechanical and electrical connection to the mating board.

Edgeboard Connectors Feature Summary

• Dual-row header design accommodating 52 positions for high-density interconnect applications
• Gold-plated copper alloy contacts ensure corrosion resistance and stable signal transmission
• Vertical panel mount style facilitates structured chassis integration and cable management
• Solder eyelet termination provides robust mechanical stability for heavy-duty environments

Edgeboard Connectors Applications

• Industrial control systems requiring durable panel-mounted interfaces
• Telecommunications equipment utilizing standard card edge form factors
• Automotive electronics needing reliable vertical interconnects
• Test and measurement instrumentation panels

Edgeboard Connectors Procurement Notes

Verify that the specific ordering suffix matches the required termination style and contact finish. Confirm the package quantity aligns with production needs, as bulk packaging is standard. Ensure compatibility with the target PCB thickness of 0.062 inches. Cross-reference the manufacturer part number against official distributor catalogs to confirm current availability status and lead times before finalizing procurement orders.

Edgeboard Connectors Selection Notes

Select this component when a dual-row, 52-position interface is required for vertical panel mounting. The 3.96 mm pitch suits applications needing moderate density without excessive footprint constraints. Gold plating is essential for environments where oxidation resistance is critical. Verify that the solder eyelet termination method aligns with the assembly process capabilities and that the housing material meets the operational temperature requirements.

Edgeboard Connectors Part Context

This connector belongs to the EDAC 305 series, which specializes in standard card edge headers. The series offers various position counts and termination options while maintaining consistent 3.96 mm spacing. This specific model represents a mid-range position count within the family, balancing connectivity density with physical size constraints for standard industrial enclosures.

Edgeboard Connectors Replacement Considerations

Direct substitutes include other EDAC 305 series variants with identical 52-position dual-row configurations and solder eyelet terminations. Verify that any alternative maintains the same 3.96 mm pitch and 1.57 mm board thickness tolerance. Cross-check insulation resistance ratings and current capacity specifications to ensure equivalent performance in the target application.