351-10-150-00-004000

Headers, Male Pins Overview

The Mill-Max 351-10-150-00-004000 is a vertical pin header connector featuring 150 positions with a 2.54mm pitch. It utilizes brass alloy contacts with gold plating for reliable signal transmission. Designed for through-hole mounting, this single-row connector supports wave soldering assembly processes. The component is engineered for high-reliability applications requiring precision-machined interconnects.

Headers, Male Pins Feature Summary

• Precision-machined construction for high reliability
• Gold-plated brass alloy contacts ensure stable conductivity
• Vertical orientation facilitates board-to-board connections

Headers, Male Pins Applications

• High-density electronic assemblies
• Industrial control systems
• Telecommunications equipment

Headers, Male Pins Procurement Notes

Verify the exact part number against official Mill-Max documentation to confirm contact configuration and plating specifications. Ensure compatibility with wave soldering processes if required by the manufacturing workflow. Cross-reference with authorized distributors to validate current availability status and lead times before finalizing procurement plans.

Headers, Male Pins Selection Notes

Select this component when a high-count, single-row header is necessary for vertical board interconnection. The 2.54mm pitch ensures compatibility with standard PCB layouts. Consider the gold plating for environments requiring corrosion resistance and low contact resistance over extended operational lifecycles.

Headers, Male Pins Part Context

This part belongs to the Mill-Max 351 series of rectangular connectors. The series is characterized by precision-machined components designed for demanding interconnect applications. Mill-Max Manufacturing Corp. specializes in high-reliability solutions for various industrial sectors.

Headers, Male Pins Replacement Considerations

Direct substitutes may include other 150-position, 2.54mm pitch headers from manufacturers such as Samtec or Molex. Verify mechanical dimensions, contact material, and plating thickness to ensure functional equivalence without redesigning the host PCB footprint.