71V35761S200BG

Memory IC Overview

The 71V35761S200BG is a synchronous single-data-rate static random-access memory integrated circuit manufactured by Renesas Electronics Corporation. It provides a total storage capacity of 4.5 megabits, organized as 128 kilowords by 36 bits. The device supports parallel interface operations with a maximum clock frequency of 200 MHz and features an access time of 3.1 nanoseconds. It operates within a supply voltage range of 3.135 volts to 3.465 volts and is housed in a 119-pin plastic ball grid array package measuring 14 by 22 millimeters.

Memory IC Feature Summary

• Supports high-speed synchronous data transfer via a parallel interface architecture
• Provides pipelined burst read capabilities for efficient data throughput
• Integrates on-chip clock and data registers to align input and output signals

Memory IC Applications

• High-performance computing systems requiring fast memory access
• Network infrastructure equipment such as routers and switches
• Industrial automation controllers demanding real-time data processing

Memory IC Procurement Notes

Verify the exact suffix designation against official Renesas documentation, as variations like BGGI or BG8 indicate specific packaging or environmental grades. Confirm current availability status, as this component may be subject to discontinuation notices. Ensure compatibility with existing board layouts regarding the 119-PBGA footprint and thermal requirements before finalizing procurement decisions.

Memory IC Selection Notes

Select this component when system design requires a 36-bit wide data path synchronized with a high-frequency clock source. Evaluate power consumption limits against the specified operating voltage range. Consider the physical dimensions of the 119-ball BGA package for adequate printed circuit board space and thermal dissipation strategies during the hardware layout phase.

Memory IC Part Context

This part belongs to the 71V35761S family of synchronous SRAM devices designed for applications needing large word widths and high bandwidth. The series typically offers various speed grades and package options to accommodate different performance and form factor constraints within embedded and industrial electronic systems.

Memory IC Replacement Considerations

Check for direct pin-compatible substitutes within the same product family that share identical electrical characteristics and package dimensions. Verify if alternative speed grades meet the timing requirements without necessitating circuit redesign.