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A-WBP-K002DG-12TB02 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Assmann WSW Components. Its product description is WIRE-TO-BOARD, WAFER, 2.00MM, 12. Review the specifications below when checking this part for your BOM.
The A-WBP-K002DG-12TB02 is a wire-to-board connector header manufactured by Assmann WSW Components. It features a through-hole mounting style with 12 positions arranged in a single row. The component utilizes a 2.00mm (0.079 inch) pitch between contacts, ensuring precise alignment for mating connectors. Designed for reliable electrical connections, this header supports standard PCB assembly processes and provides a secure interface for signal or power transmission in electronic circuits.
Verify the specific pin count and pitch against the target PCB footprint before ordering. Confirm that the mating connector matches the 2.00mm wafer series specifications to ensure proper mechanical fit and electrical continuity. Check RoHS compliance requirements if applicable to the end product regulations.
Select this component when a 12-position through-hole header is required for wire-to-board applications. Ensure the available vertical height accommodates the mating connector clearance. Consider the current rating and voltage limits of the associated system to guarantee safe operation within the specified environmental conditions.
This part belongs to the A-WBP-K002DG series of headers from Assmann WSW Components. The series offers various position counts while maintaining a consistent 2.00mm pitch and through-hole technology. These components are widely used in connectivity solutions where reliable, space-efficient board-level connections are necessary for modern electronic designs.
Compatible substitutes include other 12-position, 2.00mm pitch through-hole headers from manufacturers such as Molex, JST, or Samtec, provided the mechanical dimensions and electrical ratings match. Verify that the alternative part shares the same contact plating and housing material properties for equivalent performance.
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