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A1P25S12M3-F is listed in the IGBT Modules range at ChipApex. The manufacturer field lists STMicroelectronics. Its product description is IGBT MOD 1200V 25A 197W ACEPACK1. Review the specifications below when checking this part for your BOM.
IGBT Modules specifications for A1P25S12M3-F
- Description：IGBT MOD 1200V 25A 197W ACEPACK1
- Series：-
- Mfr：STMicroelectronics
- Package：Tray
- IGBT Type：Trench Field Stop
- Configuration：Three Phase Inverter
- Vce(on) (Max) @ Vge, Ic：2.45V @ 15V, 25A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：ACEPACK™ 1
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：25 A
- Power - Max：197 W
- Current - Collector Cutoff (Max)：100 µA
- Input Capacitance (Cies) @ Vce：1.55 nF @ 25 V
IGBT Modules datasheet and documents for A1P25S12M3-F
IGBT Modules Overview
The A1P25S12M3-F is a sixpack IGBT power module in the ACEPACK™ 1 package, integrating trench gate field-stop M series technology. It features 1200 V blocking voltage and 25 A continuous collector current at TC = 100 °C. The module includes soft recovery diodes and an integrated NTC thermistor (5 kΩ at 25 °C). Key electrical parameters include a maximum collector-emitter saturation voltage of 2.45 V at IC = 25 A and VGE = 15 V. Total power dissipation is rated at 197 W per IGBT at TC = 25 °C. The device utilizes press-fit contact pins for mounting and operates within a junction temperature range of -40 to 150 °C under switching conditions.
IGBT Modules Feature Summary
- Sixpack topology with trench gate field-stop IGBTs and soft recovery diodes
- Integrated NTC temperature sensor for thermal monitoring
- Press-fit contact pins for secure PCB mounting
- DBC Cu Al2O3 Cu substrate construction
IGBT Modules Applications
- Inverters
- Industrial applications
- Motor drives
IGBT Modules Procurement Notes
Verify component authenticity through authorized STMicroelectronics distributors or official sales channels. Confirm datasheet revision status prior to design finalization. Ensure ordering suffix matches exact specifications. Check product lifecycle status as availability may vary by region.
IGBT Modules Selection Notes
Select based on required voltage class and current rating for specific converter topologies. Consider thermal resistance values for heatsink design calculations. Verify gate drive compatibility with specified VGE limits. Evaluate switching energy characteristics against system efficiency targets up to 20 kHz.
IGBT Modules Part Context
This component belongs to the ACEPACK™ 1 family of power modules from STMicroelectronics. It represents part of the broader STPOWER portfolio designed for high-efficiency power switching applications. The module integrates advanced silicon technologies optimized for compact and robust solutions in industrial and automotive sectors.
IGBT Modules Replacement Considerations
Check for direct pin-compatible alternatives within the same ACEPACK™ 1 series. Verify electrical parameter equivalence for voltage, current, and thermal ratings. Consult official substitution lists for end-of-life notifications.
Explore related parts through IGBTs, Transistors, Discrete Semiconductor Products, all product categories.
