SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The A24N20MPP is a perforated backplate manufactured by Hoffman Enclosures, Inc. Designed for use with medium-type enclosures, this component measures 21 inches in length and 18.5 inches in width. It is constructed from steel and features a gray finish. The panel is engineered to facilitate the mounting of lightweight control components within Type 1 and 3R enclosure systems.
Verify that the target enclosure dimensions match the 21 x 18.5 inch specifications of the A24N20MPP. Confirm that the application involves only lightweight components, as the panel design supports limited load capacity. Ensure compatibility with self-tapping screw fastening methods required by the perforated holes.
Select this part when retrofitting or building enclosures requiring pre-drilled mounting points. It is suitable for applications where reducing assembly time by removing manual drilling steps is prioritized. Ensure the enclosure type aligns with the panel's intended use for Type 1 and 3R environments.
This perforated backplate serves as an accessory for Hoffman medium-type enclosures. It replaces the need for custom fabrication of mounting surfaces. The component integrates into standard enclosure assemblies to provide immediate mounting infrastructure for electrical controls.
No public confirmed substitute part numbers are available.

Over the past week, the global electronic components sector has witnessed dual transformations in policy and technology: Coupled with mounting pressure from a worsening…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read More
Stay ahead with ChipApex Insights — technical deep dives, market trends, and sourcing tips for memory, microcontrollers, power management, and industrial-grade components. Trusted by…
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read More
Geneva, Switzerland – March 25, 2026 – STMicroelectronics N.V. (NYSE: STM), a global semiconductor leader serving customers across the electronics applications spectrum, has announced…
Read More
As the backbone of modern technology, electronic components are undergoing revolutionary changes, driven by advancements in materials science, miniaturization, and smart manufacturing. From ultra-efficient…
Read MoreDutch authorities announced on November 7 the lifting of control measures on Nexperia (formerly NXP Semiconductors’ Standard Products division), marking the end of a…
Read MoreWilmington, Mass. & Milpitas, Calif. – May 19, 2026 – Analog Devices, Inc. (NASDAQ: ADI), a global leader in high-performance analog and mixed-signal semiconductors,…
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read MoreAs 2025 draws to a close, the global semiconductor industry stands at a crossroads. Intertwined with escalating geopolitical tensions, supply chain disruptions, and groundbreaking…
Read More