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ADG711BR-REEL7 is listed in the Analog Switches, Multiplexers, Demultiplexers range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is IC SWITCH SPST-NCX4 4OHM 16SOIC. Review the specifications below when checking this part for your BOM.
The ADG711BR-REEL7 is a CMOS low voltage, quad single-pole single-throw (SPST) analog switch manufactured by Analog Devices Inc. It operates on a single supply ranging from 1.8 V to 5.5 V and features a typical on resistance of 2.5 Ω with a maximum of 4.5 Ω at 5 V. The device provides a −3 dB bandwidth exceeding 200 MHz and fast switching times with tON max of 16 ns and tOFF max of 10 ns. It supports rail-to-rail operation and is compatible with TTL/CMOS logic levels. The component is housed in a 16-lead Standard Small Outline (SOIC) package and functions within an operating temperature range of −40°C to +85°C.
Verify the specific ordering suffix to confirm the package type. The BR-REEL7 designation indicates the Standard Small Outline (SOIC) package variant. Confirm RoHS compliance status if required for the manufacturing process. Ensure the digital control inputs match the system logic voltage levels before integration.
Select this component when a quad SPST configuration is required for low voltage single-supply applications. The SOIC package option is suitable for designs prioritizing standard footprint compatibility over the smaller TSSOP alternative. Verify that the 2.5 Ω typical on resistance meets the signal integrity requirements of the target application.
The ADG711 belongs to the ADG711/ADG712/ADG713 family of CMOS analog switches. While sharing identical electrical specifications, the family differentiates based on internal channel configurations: the ADG711 offers four independent SPST switches, the ADG712 provides two complementary pairs, and the ADG713 includes break-before-make timing for multiplexer use.
The ADG711BRU-REEL7 serves as a direct functional substitute but utilizes a 16-lead TSSOP package instead of the SOIC form factor. Designers must verify mechanical clearance and pinout alignment when transitioning between these package types.
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