ADP61075W3-L

$980.48

Description：POWER MODULE
Series：ECOPACK®

SKU:cf16183da263 Category: FET, MOSFET Arrays Brand: STMicroelectronics

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Product introduction

ADP61075W3-L is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists STMicroelectronics. Its product description is POWER MODULE. Review the specifications below when checking this part for your BOM.

FET, MOSFET Arrays specifications for ADP61075W3-L

Description：POWER MODULE
Series：ECOPACK®
Mfr：STMicroelectronics
Package：Bulk
Technology：Silicon Carbide (SiC)
Configuration：6 N-Channel
FET Feature：-
Drain to Source Voltage (Vdss)：750V
Current - Continuous Drain (Id) @ 25°C：-
Rds On (Max) @ Id, Vgs：-
Vgs(th) (Max) @ Id：4.4V @ 50mA
Gate Charge (Qg) (Max) @ Vgs：-
Input Capacitance (Ciss) (Max) @ Vds：-
Power - Max：869W (Tj)
Operating Temperature：-40°C ~ 175°C (TJ)
Mounting Type：Chassis Mount
Package / Case：Module
Supplier Device Package：-
Grade：-
Qualification：-

FET, MOSFET Arrays datasheet and documents for ADP61075W3-L

ADP61075W3-L

FET, MOSFET Arrays Overview

The STMicroelectronics ADP61075W3-L is an automotive-grade ACEPACK DRIVE power module featuring a six-pack topology. It supports a blocking voltage of 750 V and delivers a typical on-resistance (RDS(on)) of 1.2 mΩ. The device handles a current rating of 623 A and operates with a maximum junction temperature of 175 °C. Qualified to AQG 324 standards, it utilizes a 9-pin surface-mount package designed for direct liquid cooling via a base plate with pin-fins.

FET, MOSFET Arrays Feature Summary

Automotive-grade qualification compliant with AQG 324 standards
Six-pack MOSFET topology optimized for high-power applications
Direct liquid cooling capability through a base plate with pin-fins

FET, MOSFET Arrays Applications

Automotive traction inverters
On-board chargers
DC-DC converters

FET, MOSFET Arrays Procurement Notes

Verify the specific ordering suffix against the manufacturer's official datasheet to confirm exact electrical characteristics and thermal specifications. Ensure compatibility with the intended cooling system design, as this component requires direct liquid cooling. Confirm that the selected variant meets all required automotive reliability standards before integration into production designs.

FET, MOSFET Arrays Selection Notes

Select this module for applications requiring high current density and robust thermal management in automotive environments. The low on-resistance minimizes conduction losses, while the six-pack topology simplifies circuit design. Ensure the system architecture supports the necessary liquid cooling infrastructure to maintain optimal junction temperatures during operation.

FET, MOSFET Arrays Part Context

This component belongs to the ACEPACK DRIVE series, a family of power modules designed specifically for demanding automotive power electronics. The series emphasizes high efficiency and compact form factors suitable for electric vehicle powertrains. The ADP61075W3-L represents a high-performance variant within this lineup, focusing on reducing switching energy and enhancing thermal dissipation capabilities.