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ADS7816PCG4 is listed in the Analog To Digital Converters (ADC) range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC ADC 12BIT SAR 8DIP. Review the specifications below when checking this part for your BOM.
The ADS7816PCG4 is a 12-bit successive approximation register (SAR) analog-to-digital converter manufactured by Texas Instruments. It operates with a single 5V supply and supports sampling rates up to 200 kSPS. The device features a serial interface compatible with standard SPI protocols, utilizing three control lines for data transfer. It accepts differential or single-ended input signals within a specified voltage range. Power consumption is minimized at approximately 1.9 mW during operation. The component is housed in an 8-pin SOIC package and functions reliably across an industrial temperature range from -40°C to +85°C.
Verify the specific suffix 'PCG4' against official Texas Instruments documentation to confirm pinout compatibility and RoHS status. Ensure the ordering part number matches the exact package type and temperature grade required for your design. Cross-reference with current datasheets to validate availability and any recent manufacturing changes.
Select this component when a 12-bit resolution and 200 kSPS speed are required in a compact SOIC-8 package. It is suitable for applications needing a single 5V supply and serial communication. Consider alternative packages if higher channel counts or different interface standards are necessary. Verify input voltage ranges match the sensor output specifications.
This part belongs to the ADS7816 family of micro-power sampling ADCs. It shares architectural similarities with other members like the ADS7816U and ADS7816EB, differing primarily in packaging and commercial/industrial temperature ratings. The series is designed for applications balancing speed and power efficiency in portable devices.
Direct replacements include ADS7816P and ADS7816U. Verify package dimensions and pin assignments before substitution. Ensure thermal performance meets system requirements for the new package variant.
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