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The APT33GF120B2RDQ2G is a silicon Insulated Gate Bipolar Transistor (IGBT) manufactured by Microchip Technology. It features a PT MOS 7 Combi technology architecture designed for high-efficiency switching applications. The device is housed in a TO-247MAX package with three leads and supports through-hole mounting. Key electrical specifications include a collector-emitter maximum voltage (VCEO) of 1200 V, a continuous collector current of 35 A at 25°C, and a gate-emitter maximum voltage rating of ±20 V. The component operates within a temperature range from -55°C to +150°C junction temperature.
Verify the specific suffix RDQ2G against official Microchip documentation to confirm packaging and tape-and-reel specifications. Ensure compatibility with existing thermal interface materials and gate drive requirements before integration. Cross-reference the datasheet for absolute maximum ratings to prevent operational overstress during procurement validation.
Select this component for applications requiring 1200 V blocking capability and 35 A continuous current handling. Compare saturation voltage characteristics against alternative IGBTs to ensure efficiency targets are met. Consider the TO-247MAX footprint constraints and thermal dissipation needs when designing the printed circuit board layout for optimal heat transfer.
This part belongs to the APT series of discrete power semiconductors offered by Microchip Technology. The series focuses on providing cost-effective solutions for medium-power industrial applications. The APT33GF120B2RDQ2G represents a specific configuration within this lineup, tailored for designs needing standard through-hole mounting and proven silicon IGBT reliability.
Consult official Microchip resources for direct cross-references. Verify pinout compatibility and thermal resistance values if substituting with other 1200 V, 35 A TO-247MAX IGBTs from different manufacturers.