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Product Detailed Parameters
- Description：PM-IGBT-TFS-SP6C
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- IGBT Type：-
- Configuration：Single Chopper
- Vce(on) (Max) @ Vge, Ic：1.8V @ 15V, 600A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：-
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：805 A
- Power - Max：1.923 kW
- Current - Collector Cutoff (Max)：50 µA
- Input Capacitance (Cies) @ Vce：120000 pF @ 25 V
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Overview
The APTGX600SK120T6G is a single chopper IGBT module from Microchip Technology, designed for high-power applications. It features a 1200 V collector-emitter voltage rating and supports a continuous collector current of 805 A at 25°C. The device exhibits a maximum collector-emitter saturation voltage of 1.8 V and handles a power dissipation of 1923 W. Packaged in the SP6C form factor with screw mount installation, it operates within a temperature range of -40°C to +125°C.
Feature Summary
- High-speed IGBT4 technology optimized for low switching losses and low forward voltage drop
- Robust SP6C packaging designed for chassis mounting in demanding industrial environments
- Integrated design supporting high current density and efficient thermal management
Applications
- Industrial motor drives and inverters
- Uninterruptible power supplies (UPS)
- Induction heating systems
Procurement Notes
Verify the specific suffix T6G against the official datasheet to confirm package variant and terminal configuration. Ensure compatibility with SP6C mounting hardware and thermal interface materials. Cross-reference electrical ratings with system requirements before integration.
Selection Notes
Select this component for applications requiring high current handling up to 805 A and robust 1200 V blocking capability. Consider the SP6C package dimensions for mechanical layout and verify thermal resistance parameters for heatsink design. Evaluate switching speed requirements against the IGBT4 technology characteristics.
Part Context
This module belongs to Microchip's high-speed IGBT4 power module family. It utilizes silicon technology to deliver enhanced performance compared to previous generations. The SP6C package provides a standardized footprint for easy integration into existing industrial power conversion architectures.
Replacement Considerations
Direct substitutes include APTGX600DU120T6G and APTGX600DA120T6G. Verify pinout compatibility and thermal characteristics when considering these alternatives within the same product series.
