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Product Detailed Parameters
- Description：MOSFET 2N-CH 100V 278A SP4
- Series：-
- Mfr：Microsemi Corporation
- Package：Bulk
- Technology：MOSFET (Metal Oxide)
- Configuration：2 N-Channel (Dual)
- FET Feature：-
- Drain to Source Voltage (Vdss)：100V
- Current - Continuous Drain (Id) @ 25°C：278A
- Rds On (Max) @ Id, Vgs：5mOhm @ 125A, 10V
- Vgs(th) (Max) @ Id：4V @ 5mA
- Gate Charge (Qg) (Max) @ Vgs：700nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds：20000pF @ 25V
- Power - Max：780W
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP4
- Supplier Device Package：SP4
- Grade：-
- Qualification：-
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Overview
The APTM10DUM05TG is a dual common source MOSFET power module manufactured by Microsemi Corporation. It utilizes Power MOS V technology to deliver low on-resistance and high ruggedness. The device features a 100V drain-source breakdown voltage and supports continuous drain currents up to 278A at 25°C case temperature. With a maximum power dissipation of 780W, it incorporates internal thermistors for temperature monitoring and Kelvin sources for precise gate drive control.
Feature Summary
- Dual common source configuration with symmetrical design for low stray inductance
- Integrated NTC thermistor for direct temperature monitoring
- Kelvin source connection enables easy and accurate gate drive
- Isolated package allows direct mounting to heatsinks
Applications
- AC Switches
- Switched Mode Power Supplies
- Uninterruptible Power Supplies
Procurement Notes
Verify the specific revision level against current Microsemi documentation before finalizing designs. Confirm thermal interface requirements match the specified mounting torque. Ensure electrostatic discharge handling procedures are strictly followed during assembly. Check for updated application notes regarding the internal thermistor circuitry.
Selection Notes
Select this component for applications requiring high-frequency operation and robust avalanche energy ratings. The SP4 package provides low junction-to-case thermal resistance suitable for high-power density designs. Evaluate the need for integrated temperature sensing versus external monitoring solutions based on system complexity.
Part Context
This module belongs to the APTM series of dual common source MOSFET power modules from Microsemi. It is designed for high-performance power conversion systems where low switching losses and high reliability are critical. The SP4 package format facilitates efficient thermal management and PCB integration.
Replacement Considerations
Consult official cross-reference tools for parametrically similar parts. Verify that any substitute matches the SP4 package outline and pinout configuration. Ensure replacement devices meet the same isolation voltage and thermal resistance specifications.
