APTM20AM08FTG

APTM20AM08FTG

$159.15
  • Description:MOSFET 2N-CH 200V 208A SP4
  • Series:-

SKU:fa9b4156fd6e Category: Brand:

  
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Product Detailed Parameters

  • Description:MOSFET 2N-CH 200V 208A SP4
  • Series:-
  • Mfr:Microchip Technology
  • Package:Bulk
  • Technology:MOSFET (Metal Oxide)
  • Configuration:2 N-Channel (Half Bridge)
  • FET Feature:-
  • Drain to Source Voltage (Vdss):200V
  • Current - Continuous Drain (Id) @ 25°C:208A
  • Rds On (Max) @ Id, Vgs:10mOhm @ 104A, 10V
  • Vgs(th) (Max) @ Id:5V @ 5mA
  • Gate Charge (Qg) (Max) @ Vgs:280nC @ 10V
  • Input Capacitance (Ciss) (Max) @ Vds:14400pF @ 25V
  • Power - Max:781W
  • Operating Temperature:-40°C ~ 150°C (TJ)
  • Mounting Type:Chassis Mount
  • Package / Case:SP4
  • Supplier Device Package:SP4
  • Grade:-
  • Qualification:-

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APTM20AM08FTG

Overview

The APTM20AM08FTG is a silicon MOSFET module manufactured by Microchip Technology, housed in an SP4 package. It features two N-channel FREDFET transistors configured as a half-bridge phase leg. The device supports a drain-source voltage of 200V and delivers a continuous drain current of 147A at 80°C case temperature. Key electrical parameters include a typical on-resistance of 8 milliohms, a maximum gate charge of 224nC at 10V, and a maximum input capacitance of 13700pF at 25V. It operates within a junction temperature range of -40°C to 150°C and is designed for chassis mounting.

Feature Summary

  • Integrates two N-channel FREDFET transistors into a single half-bridge configuration for efficient power switching.
  • Utilizes Fast Recovery Epitaxial Diode technology to optimize reverse recovery characteristics.
  • Features a robust chassis-mountable SP4 package designed for high-power thermal management applications.

Applications

  • High-frequency DC-DC converters
  • Motor drive inverters
  • Uninterruptible power supplies (UPS)

Procurement Notes

Verify the specific ordering suffix FTG against official Microchip documentation to confirm compliance with RoHS standards and lead-free manufacturing processes. Confirm that the SP4 package variant matches the required mechanical footprint and thermal interface specifications for the target application design before finalizing procurement orders.

Selection Notes

Select this component when a 200V half-bridge solution with low on-resistance is required. Ensure the thermal design accommodates the 147A continuous current rating at the expected case temperature. Compare against alternative packages if space constraints differ from the standard SP4 dimensions.

Part Context

This part belongs to the APTM series of discrete power modules from Microchip Technology. It represents a silicon-based solution utilizing FREDFET technology, distinct from the manufacturer's newer silicon carbide offerings. The SP4 packaging provides a standardized form factor for industrial power electronics integration.

Replacement Considerations

Consult official Microchip substitution guides for verified alternatives. Cross-reference pinouts and thermal characteristics carefully when considering generic equivalents to ensure functional compatibility.

APTM20AM08FTGAPTM20AM08FTG
$159.15
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