APTM20HM16FTG

Overview

The APTM20HM16FTG is a power MOSFET module from Microchip Technology, housed in an SP4 package. It features a 200V voltage rating and supports continuous drain currents of 77A to 104A depending on specific operational conditions. The device includes an integrated NTC thermistor for thermal monitoring and utilizes FASTON connectors for electrical mounting. Key electrical parameters include a maximum on-state resistance of 19mΩ and a pulsed drain current capacity of 416A. The module is designed for chassis mounting with a power dissipation rating of 390W and operates within a junction temperature range of -40°C to 150°C.

Feature Summary

• Integrated H-bridge topology with built-in NTC thermistor for precise thermal management
• Robust mechanical design utilizing FASTON connectors and screw mounting for secure installation
• High surge current capability supporting demanding transient load conditions

Applications

• Industrial motor drive systems requiring high reliability
• Inverter circuits in renewable energy applications
• Uninterruptible power supply (UPS) architectures

Procurement Notes

Verify the exact datasheet revision and ordering suffix to ensure compatibility with your system requirements. Confirm that the SP4 package dimensions and FASTON connector specifications match your mechanical layout. Ensure thermal interface materials are suitable for the specified power dissipation and operating temperature range. Cross-reference the NTC thermistor characteristics with your control circuitry for accurate temperature monitoring.

Selection Notes

Select this component when a pre-configured H-bridge solution with integrated thermal sensing is required. The SP4 package offers a balance of power density and ease of mounting via FASTON connectors. Consider the 19mΩ on-state resistance for efficiency calculations and verify that the 416A pulsed current rating exceeds peak load demands. Ensure the 200V blocking voltage aligns with the system bus voltage.

Part Context

This module belongs to Microchip's Power-Max series, which integrates multiple power devices into a single package to reduce board space and simplify assembly. The SP4 case style is common for medium-power industrial applications, providing standardized mounting and connection interfaces. The inclusion of an NTC thermistor distinguishes it from basic discrete modules by enabling direct thermal feedback to the controller.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Verify pinout and electrical ratings against existing designs before considering alternative manufacturers.