APTM20HM20STG

$144.87

Description：MOSFET 4N-CH 200V 89A SP4
Series：-

SKU:2d636ebe5580 Category: FET, MOSFET Arrays Brand: Microchip Technology

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Product introduction

Product Detailed Parameters

Description：MOSFET 4N-CH 200V 89A SP4
Series：-
Mfr：Microchip Technology
Package：Bulk
Technology：MOSFET (Metal Oxide)
Configuration：4 N-Channel (Full Bridge)
FET Feature：-
Drain to Source Voltage (Vdss)：200V
Current - Continuous Drain (Id) @ 25°C：89A
Rds On (Max) @ Id, Vgs：24mOhm @ 44.5A, 10V
Vgs(th) (Max) @ Id：5V @ 2.5mA
Gate Charge (Qg) (Max) @ Vgs：112nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds：6850pF @ 25V
Power - Max：357W
Operating Temperature：-40°C ~ 150°C (TJ)
Mounting Type：Chassis Mount
Package / Case：SP4
Supplier Device Package：SP4
Grade：-
Qualification：-

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APTM20HM20STG

Overview

The APTM20HM20STG is a power module from Microchip Technology utilizing silicon technology. It features an H-bridge topology with parallel and series diodes, housed in an SP4 chassis mount package. The device supports FASTON electrical mounting connections. Key electrical ratings include a drain current of 66A and a continuous power dissipation of 357W. The module integrates an NTC thermistor for thermal monitoring.

Feature Summary

H-bridge topology configuration
Integrated NTC thermistor
Chassis mount design

Applications

Motor drive systems
Power conversion circuits
Industrial control applications

Procurement Notes

Verify the specific pinout and thermal interface requirements against your system design before procurement. Confirm that the FASTON connector type matches your wiring harness. Ensure the chassis mounting holes align with your mechanical layout. Check the datasheet for detailed thermal resistance values to calculate heatsink requirements accurately.

Selection Notes

Select this component when an H-bridge configuration with integrated sensing is required. Consider the 66A current rating and 357W power dissipation limits for your thermal management strategy. The SP4 package size dictates the physical footprint constraints. Evaluate the need for parallel and series diode integration within the bridge structure.

Part Context

This part belongs to the Microchip power module family designed for high-current applications. It combines multiple semiconductor devices into a single chassis-mount unit. The SP4 package provides a standardized form factor for industrial equipment. Integration of the NTC thermistor simplifies temperature monitoring in complex power systems.

Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation. Verify compatibility with existing thermal and mechanical designs if considering alternatives.