AT-30511-TR1G

Overview

The Broadcom AT-30511-TR1G is a high-performance NPN silicon bipolar transistor housed in a SOT-143 surface-mount package. It is optimized for low voltage operation, specifically at 2.7 V and 1 mA bias current. Key electrical parameters include a maximum collector-emitter voltage (VCEO) of 5.5 V, a maximum collector current (IC) of 8 mA, and a power dissipation rating of 100 mW. At 900 MHz with VCE = 2.7 V and IC = 1 mA, the device achieves a typical noise figure of 1.1 dB and an associated gain of 16 dB.

Feature Summary

• Optimized for maximum transition frequency at low voltage operation
• Features five emitter finger interdigitated geometry for high speed and gain
• Fabricated using self-aligned-transistor process technology

Applications

• Low Noise Amplifiers (LNA)
• Gain stages
• Battery operated wireless systems

Procurement Notes

Verify that the ordering suffix TR1G corresponds to the tape-and-reel packaging format containing 3000 devices on a 7-inch reel. Confirm the lead-free option requirement matches the 'G' designation. Ensure compatibility with standard surface mount assembly techniques before finalizing procurement orders.

Selection Notes

Select this component when designing circuits requiring high performance at low supply voltages, such as 2.7 V battery-powered systems. The SOT-143 package provides higher performance compared to the SOT-23 variant. Consider the specific noise figure and gain requirements at 900 MHz, 1.8 GHz, or 2.4 GHz frequencies during the design phase.

Part Context

This part belongs to the AT-305 series of NPN silicon bipolar transistors manufactured by Agilent Technologies, now part of Broadcom Limited. The series includes the AT-30533, which utilizes a SOT-23 package but shares the same die characteristics. Both variants are designed for wireless market applications requiring efficient low-current operation.

Replacement Considerations

The AT-30533 serves as a functional alternative within the same family, utilizing identical internal die structures but packaged in a SOT-23 form factor instead of SOT-143. Designers must account for potential differences in thermal resistance and parasitic capacitance due to the distinct package geometries when substituting components.