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The BC846AW is a single NPN general-purpose small-signal bipolar junction transistor manufactured by Taiwan Semiconductor Corporation. It utilizes an epitaxial silicon planar design housed in a SOT-323 surface-mount package. The device supports a maximum collector current of 100 mA and offers a collector-emitter breakdown voltage (VCEO) of 65 V. Key electrical characteristics include a DC current gain (hFE) minimum of 110 at 2 mA and 5 V, a transition frequency (fT) of 100 MHz, and a power dissipation rating of 150 mW. The component operates within a temperature range of -65°C to +150°C.
Verify the manufacturer marking on the component body matches the specified part number to ensure authenticity. Confirm that the ordering suffix corresponds to the desired packaging format, as variations exist between tape-and-reel and cut-tape options. Ensure compliance with RoHS and halogen-free requirements if mandated by the end-product specifications. Cross-reference datasheet revisions to confirm parameter consistency before finalizing procurement.
Select this component when a compact NPN transistor with 65 V collector-emitter voltage is required for space-constrained designs. The SOT-323 package provides a smaller footprint compared to standard SOT-23 variants while maintaining similar electrical performance. Consider the 150 mW power dissipation limit when designing thermal management strategies for high-density PCB layouts.
This component belongs to the BC846 series of NPN general-purpose transistors. It shares functional similarities with other manufacturers' equivalents such as the Nexperia BC846A or Panasonic 2SC4081, though pinout and specific electrical limits may vary slightly. The BC846AW designation specifically indicates the Taiwan Semiconductor manufacturing source and the SOT-323 package configuration.
Direct substitutes include the Nexperia BC846AW and Micro Commercial Components BC846AW-TP. Verify that replacement parts maintain the same SOT-323 package dimensions and pinout configuration to ensure mechanical compatibility without PCB redesign.