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The BC849CWE6327 is a single NPN silicon small-signal bipolar junction transistor (BJT) manufactured by Infineon Technologies. It is housed in an SOT-363-6 surface-mount package designed for automated assembly. The device supports a maximum DC collector current of 100 mA and features a collector-emitter breakdown voltage (VCEO) of 30 V, with a collector-base voltage (VCBO) of 30 V. The emitter-base voltage (VEBO) is rated at 6 V. Power dissipation capability is 330 mW, and the transition frequency (fT) reaches 250 MHz. Operating temperatures range from -65 °C to +150 °C.
Verify component authenticity through official Infineon channels or authorized distributors. Confirm RoHS compliance status via the specific datasheet revision. Check manufacturing lifecycle status as availability may vary. Ensure storage conditions meet moisture sensitivity level requirements before soldering.
Select this component when high current gain is required for low-level signal processing. The SOT-363-6 package offers a compact footprint compared to standard SOT-23 variants while maintaining similar electrical characteristics. Consider thermal management constraints due to the 330 mW power dissipation rating in dense PCB layouts.
This part belongs to the BC849 series of NPN transistors, which are optimized for high-gain applications. It shares the same electrical specifications as the BC849C but utilizes the E6327 ordering suffix indicating specific tape-and-reel packaging configurations defined by Infineon for automated surface-mount production lines.
The minimum DC current gain is 420, and the maximum is 800.
No, it is exclusively available in the SOT-363-6 surface-mount package.
The collector-emitter saturation voltage is typically 200 mV.