Balun BD2425N5050AHF product image

BD2425N5050AHF

$0.40
  • Description:BALUN 2.4GHZ-2.5GHZ 50/50 0404
  • Series:Xinger®
  • Mfr:TTM Technologies, Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:2baac04df511 Category: Brand:

  
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BD2425N5050AHF is listed in the Balun range at ChipApex. The manufacturer field lists TTM Technologies, Inc.. Its product description is BALUN 2.4GHZ-2.5GHZ 50/50 0404. Review the specifications below when checking this part for your BOM.

Balun specifications for BD2425N5050AHF

  • Description:BALUN 2.4GHZ-2.5GHZ 50/50 0404
  • Series:Xinger®
  • Mfr:TTM Technologies, Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Frequency Range:2.4GHz ~ 2.5GHz
  • Impedance - Unbalanced/Balanced:50 / 50Ohm
  • Phase Difference:3°
  • Insertion Loss (Max):0.9dB
  • Return Loss (Min):15dB
  • Package / Case:0404 (1010 Metric)
  • Mounting Type:Surface Mount

Balun datasheet and documents for BD2425N5050AHF

BD2425N5050AHF

Balun Overview

The BD2425N5050AHF is an ultra-low profile surface-mount balun manufactured by TTM Technologies under the Xinger brand. Designed for signal conditioning, it operates within a frequency range of 2.4 GHz to 2.5 GHz. The component provides impedance transformation between unbalanced and balanced ports, both rated at 50 Ohms. It features a maximum insertion loss of 0.9 dB and a minimum return loss of 15 dB. Phase difference is specified at 3 degrees. The device is housed in a compact 0404 (1010 metric) package suitable for board mounting. It supports operation across a temperature range from -55°C to +85°C and complies with RoHS standards.

Balun Feature Summary

  • Ultra-low profile construction for space-constrained PCB layouts
  • Balanced-to-unbalanced signal conversion at 50 Ohm impedance
  • Compact SMD packaging for automated assembly integration

Balun Applications

  • Wireless LAN modules operating in the 2.4 GHz ISM band
  • Bluetooth low energy transceiver interfaces
  • Wi-Fi enabled IoT sensor nodes

Balun Procurement Notes

Verify component authenticity through authorized distribution channels. Confirm that the specific ordering suffix matches the required impedance and tolerance specifications. Ensure storage conditions maintain moisture sensitivity level integrity prior to reflow soldering. Cross-reference datasheet revisions to confirm compliance with current environmental regulations.

Balun Selection Notes

Select this component when a small form factor is critical for high-frequency RF applications. The 0404 package size offers significant space savings compared to larger discrete solutions. Consider the 0.9 dB insertion loss specification for power budget calculations. Verify thermal management requirements against the -55°C to +85°C operational range during system design.

Balun Part Context

This part belongs to the Xinger series of passive RF components produced by TTM Technologies. It serves as a specialized signal conditioning element within the broader category of baluns. The product line focuses on miniaturized solutions for modern wireless communication standards requiring precise phase and amplitude balance.

Balun Replacement Considerations

Direct substitutes include the BD2425N50200AHF for different impedance configurations or the BD2425N50ATI variant for extended frequency ranges. Evaluate pin compatibility and footprint dimensions before swapping components to ensure mechanical fit.

BD2425N5050AHFBD2425N5050AHF
$0.40
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