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The BF1211WR,115 is an N-channel dual-gate MOS-FET from NXP Semiconductors, housed in a SOT343R plastic surface-mounted package. It features a drain-source voltage of 6 V, a continuous drain current of 30 mA, and a total power dissipation of 180 mW. The device exhibits a forward transfer admittance ranging from 25 to 40 mS and an input capacitance at gate 1 between 2.1 and 2.6 pF. Noise figure performance varies with frequency, reaching 0.9 dB at 400 MHz and 1.3 dB at 800 MHz under optimal source admittance conditions.
Verify the specific ordering suffix
Select this component when designing low-noise RF front-ends requiring independent gain control via the second gate. Ensure the operating environment stays within the specified junction temperature limits and that the 6 V drain-source voltage rating is not exceeded. Consider the SOT343R package dimensions for PCB layout constraints and verify thermal resistance requirements for the specific mounting conditions.
This part belongs to the BF1211 series of N-channel dual-gate MOS-FETs, which includes variants like the BF1211 and BF1211R. These devices are enhancement type field-effect transistors designed for radio frequency applications. The series shares core electrical characteristics but differs in packaging and pinning configurations to suit various board space and routing requirements.
Consult official documentation for direct substitutes. The BF1211R offers reverse pinning in an SOT143R package, while the standard BF1211 uses an SOT143B package. Verify pin compatibility and thermal characteristics before substituting.
The device incorporates integrated diodes between the gates and the source to protect against excessive input voltage surges.
The second gate enables gain control functionality, allowing the device to operate as a low noise gain controlled amplifier suitable for AGC applications.
Yes, it contains a partly internal self-biasing circuit designed to ensure good cross-modulation performance during AGC and provide good DC stabilization.