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The BF556C is an N-channel symmetrical silicon junction field-effect transistor housed in a SOT23 plastic surface-mounted package. It features a drain-source voltage rating of ±30 V and a total power dissipation of 250 mW at 25 °C. The device exhibits a forward transfer admittance of at least 4.5 mS at VGS=0V and VDS=15V. Drain current (IDSS) ranges from 11 mA to 18 mA under standard conditions, with a gate-source cut-off voltage between -0.5 V and -7.5 V.
Verify the specific part marking code '26' on the component body to confirm it is the BF556C variant rather than the BF556A or BF556B. Ensure the ordering suffix matches the required manufacturing origin if specified by the design requirements. Confirm that the ESD sensitivity precautions are strictly followed during handling and transport to prevent damage to the sensitive silicon junction.
Select this component when designing circuits requiring low input impedance conversion for high-impedance sensors like electret microphones or infrared detectors. The symmetrical structure allows for flexible circuit topology. Consider the thermal resistance of 500 K/W and the need for adequate heat sinking if operating near the maximum power dissipation limit of 250 mW.
This device belongs to the BF556 series of N-channel silicon junction field-effect transistors, which also includes the BF556A and BF556B variants. These components are distinguished primarily by their drain current specifications and gate-source cut-off voltage ranges. The series is designed for general-purpose analog applications requiring high gain and low noise characteristics in small surface-mount packages.
BF556A
The marking code for the BF556C is '26'.
The typical gate-source leakage current is 500 fA.
No, unless expressly stated otherwise, this product is not automotive qualified and is not suitable for automotive use.