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BL 16 SMD 113 18 B SM is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Fischer Elektronik. Its product description is for 0.635 mm and up to 0.85 mm. Review the specifications below when checking this part for your BOM.
The Fischer Elektronik BL 16 SMD 113 18 B SM is a surface-mount board-to-board header connector. It features 18 positions arranged in two rows with a 2.54 mm (0.100 inch) pitch. The contacts are gold-plated copper beryllium alloy springs designed for precision mating. The unit utilizes a protected contact insert to prevent solder capillary action during assembly. The housing is constructed from flame-retardant material rated UL94 V-0, supporting operation within a temperature range of -40°C to +163°C.
Verify the specific part number against manufacturer datasheets to confirm contact count and row configuration. Ensure compatibility with surface-mount assembly processes. Check insulation height and mating requirements against target PCB designs. Confirm that the protected contact insert feature aligns with soldering profile constraints. Validate UL94 V-0 rating compliance for thermal safety requirements.
Select this component when surface-mount technology is required for board-to-board connections. The 2.54 mm pitch suits standard spacing layouts. The protected insert feature is critical for preventing solder wicking into contact areas. Gold plating on beryllium copper contacts offers superior performance for repeated mating cycles compared to tin-only alternatives.
This model belongs to the Fischer Elektronik BL 16 SMD 113 series of precision connectors. The series is characterized by its surface-mount capability and protected contact inserts. Variations within the series differ primarily in contact count and packaging format while maintaining consistent mechanical and electrical specifications.
Direct substitutes must match the 2-row, 18-position, 2.54 mm pitch surface-mount form factor. Verify identical protected contact insert functionality to prevent solder issues. Ensure equivalent gold-plated beryllium copper contact materials for comparable durability and conductivity.
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