BLA1011-200

Overview

The BLA1011-200 is an avionics LDMOS transistor manufactured by Ampleon USA Inc. It is designed for high-power applications in the aviation sector, specifically operating within the 1030 to 1090 MHz frequency range. The device features a single configuration with N-channel enhancement mode technology. Key electrical parameters include a maximum drain current of 2.2 A and a maximum power dissipation of 25 W. The component supports a maximum operating temperature of 200 °C, ensuring reliability under demanding thermal conditions typical of avionics transmitter systems.

Feature Summary

• High power gain capability for efficient signal amplification
• Easy power control characteristics for system management
• Excellent ruggedness suitable for harsh environments
• Source on mounting base design eliminates DC isolators

Applications

• Avionics transmitter applications
• Secondary surveillance radar (SSR) systems
• Air traffic control communication equipment

Procurement Notes

Verify the manufacturer designation carefully, as this component was originally specified by Philips Semiconductors before the separation of the RF Power division into Ampleon. Confirm that the datasheet corresponds to the specific avionics specification M3D381. Ensure compatibility with existing thermal management solutions given the 200 °C maximum operating temperature rating. Cross-reference pinouts if substituting from legacy Philips stock.

Selection Notes

Select this component for avionics transmitters requiring operation between 1030 and 1090 MHz. Consider the source-on-mounting-base feature if common-mode inductance reduction is critical for your circuit design. Evaluate the 25 W power dissipation limit against your peak power requirements. Verify that the single-ended configuration aligns with your amplifier topology needs.

Part Context

This part belongs to the family of avionics LDMOS transistors developed for military and commercial aviation standards. It supersedes earlier data sheets from October 2002, with the product specification dated November 19, 2003. The component represents the transition period where Philips Semiconductors defined these specifications prior to the establishment of Ampleon as an independent entity focused on RF power.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Users should consult official Ampleon or NXP technical support for qualified alternatives.