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The BLA6G1011LS-200RG is a 200 W LDMOS power transistor designed for avionics applications operating between 1030 MHz and 1090 MHz. It utilizes an earless flanged ceramic package (SOT502C) with two leads. Typical pulsed RF performance at 28 V supply voltage and 100 mA quiescent current includes 200 W output power, 20 dB power gain, and 65% drain efficiency. The device features enhanced ruggedness capable of withstanding a VSWR of 10:1 through all phases under specified test conditions.
Verify the specific ordering suffix against official Ampleon documentation to confirm the SOT502C earless flanged ceramic package configuration. Ensure compliance with Directive 2002/95/EC regarding Restriction of Hazardous Substances is confirmed for the intended deployment environment. Confirm that the component status aligns with current production availability requirements.
Select this component for broadband avionics transmitter designs requiring high efficiency and ruggedness within the 1030 MHz to 1090 MHz band. Verify impedance matching networks using the provided typical impedance values for the SOT502C package. Ensure thermal management solutions accommodate the transient thermal impedance characteristics defined in the datasheet.
This part belongs to the BLA6G1011 series of power LDMOS transistors from Ampleon. The LS variant specifically denotes the earless flanged ceramic package (SOT502C), distinguishing it from the standard flanged (SOT502A) and eared flanged (SOT502D) versions. All variants share identical electrical specifications and are optimized for similar avionics frequencies.
Direct replacements include BLA6G1011-200R (SOT502A) and BLA6G1011L-200RG (SOT502D). These alternatives offer identical electrical performance but differ in mechanical mounting configurations. Verify PCB layout compatibility before substitution.