BLF6G10-200RN,112

Overview

The BLF6G10-200RN is a 200 W LDMOS power transistor designed for base station applications in the 700 MHz to 1000 MHz frequency range. It operates with a drain-source voltage of 28 V and features an internal matching network for simplified integration. The device exhibits high efficiency, excellent thermal stability, and enhanced ruggedness capable of withstanding a VSWR of 10:1. Typical performance at 869 MHz to 894 MHz includes a 40 W average output power, 20 dB power gain, 28.5% drain efficiency, and -39 dBc ACPR under 2-carrier W-CDMA conditions.

Feature Summary

• Enhanced ruggedness supporting VSWR up to 10:1 across all phases
• Internally matched for ease of use and broadband operation
• Integrated ESD protection

Applications

• RF power amplifiers for GSM and GSM EDGE base stations
• W-CDMA and CDMA base station power amplifiers
• Multicarrier applications in the 700 MHz to 1000 MHz range

Procurement Notes

Verify the specific package variant required for the design. The BLF6G10-200RN utilizes the SOT502A flanged ceramic package with mounting holes, whereas the BLF6G10LS-200RN uses the SOT502B earless flanged package. Confirm that the ordering suffix matches the physical footprint requirements before finalizing procurement orders.

Selection Notes

Select this component for high-power RF amplifier designs operating between 700 MHz and 1000 MHz. Ensure the application circuit can maintain the case temperature within specified limits, as thermal resistance varies between the SOT502A and SOT502B packages. Verify that the gate biasing network supports the quiescent current requirements for the intended modulation scheme.

Part Context

This part belongs to Ampleon's LDMOS power transistor portfolio, specifically engineered for cellular infrastructure. It serves as a successor to earlier NXP semiconductor designs in the same frequency band. The device is optimized for linear amplification in multi-standard base station environments requiring high linearity and power density.

Replacement Considerations

The BLF6G10LS-200RN is a direct functional equivalent but utilizes the SOT502B earless package instead of the SOT502A flanged package. Substitution requires verification of mechanical mounting constraints and PCB layout compatibility due to the differing package outlines.