BLP15H9S10GZ

Overview

The BLP15H9S10GZ is a 10 W LDMOS driver transistor manufactured by Ampleon, designed for broadband operation from HF to 2 GHz. It features a TO-270-2G-1 surface-mount package with an exposed heatsink. Key electrical parameters include a drain-source voltage of 50 V and a breakdown voltage of 106 V. At 1400 MHz pulsed RF, it delivers 10 W output power with 21 dB gain and 65% drain efficiency. The device exhibits excellent ruggedness, supporting a VSWR of 30:1 through all phases under specific test conditions.

Feature Summary

• Designed for broadband operation across HF to 2 GHz frequencies
• Integrated dual-sided ESD protection for enhanced handling safety
• Excellent ruggedness suitable for digital and analog transmitter applications
• High power gain and efficiency with easy power control capabilities

Applications

• Broadcast transmitter applications
• Industrial, scientific and medical (ISM) applications
• Digital and analog transmitter circuits operating from HF to 2 GHz

Procurement Notes

Verify the ordering suffix GZ corresponds to the TR13 packing description with a minimum orderable quantity of 500 pieces in dry pack format. Confirm RoHS compliance status via official Ampleon product details before procurement. Ensure storage temperature limits are respected to maintain device reliability during supply chain transit.

Selection Notes

Select this component for driver stages requiring 10 W output at frequencies up to 2 GHz. The TO-270-2G-1 package facilitates surface mount integration with thermal management via the exposed heatsink. Verify that the application circuit can support the required gate-source voltage range and quiescent current settings for optimal Class-AB performance.

Part Context

The BLP15H9S10GZ belongs to the BLP15H9S family of power LDMOS transistors from Ampleon. This series targets broadcast and industrial sectors, offering high reliability and ruggedness. The 'G' suffix indicates the TO-270-2G-1 package variant, distinct from the TO-270-2F-1 package used in other family members like the BLP15H9S10Z.

Replacement Considerations

The BLP15H9S10GXY serves as a compatible alternative within the same package type but differs in packing configuration (TR7). Direct substitution requires verifying that the mechanical footprint and thermal characteristics remain identical for the specific PCB design constraints.