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BU931P is listed in the Single Bipolar Transistors range at ChipApex. The manufacturer field lists STMicroelectronics. Its product description is TRANS NPN DARL 400V 15A TO-247-3. Review the specifications below when checking this part for your BOM.
The BU931P is an automotive-grade high-voltage NPN power Darlington transistor developed using multi-epitaxial planar technology. Designed specifically for electronic ignition power actuators in automotive environments, it offers rugged bipolar construction and high operating junction temperature capability. The component features a collector-emitter voltage (V_CES) of 500 V and a collector current (I_C) of 15 A. It is housed in a TO-247 package and holds AEC-Q101 qualification.
Verify the NRND status before finalizing designs, as this indicates the component may be subject to discontinuation. Confirm that the TO-247 package dimensions and pinout match your PCB layout requirements. Ensure the design accounts for the specific thermal characteristics associated with the high operating junction temperature rating provided in the official documentation.
Select this part when designing automotive ignition systems requiring a 500 V breakdown voltage and 15 A continuous current handling. The TO-247 package provides robust mechanical stability and thermal dissipation capabilities suitable for high-power switching applications. Consider its ruggedness for general-purpose power actuator use where extreme environmental conditions are present.
This device belongs to STMicroelectronics' STPOWER family of power bipolar junction transistors. It complements other Darlington transistors in the portfolio, which offer voltage ranges up to 400 V or higher with both NPN and PNP polarities. The BU931P represents the high-voltage segment designed for demanding power switching tasks.
The BU931T is a related variant offering identical electrical specifications but packaged in TO-220 instead of TO-247. Designers requiring a different footprint should evaluate the BU931T as a direct physical alternative, ensuring thermal management strategies align with the smaller package's dissipation limits.
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