BUK9K134-100EX

Overview

The BUK9K134-100EX is a dual N-channel logic level MOSFET manufactured by Nexperia USA Inc. It utilizes TrenchMOS technology and is housed in an LFPAK56D (SOT1205) surface-mount package. The device features a drain-source voltage rating of 100 V and a continuous drain current of 8.5 A at 25 °C mounting base temperature. The maximum drain-source on-state resistance is 159 mΩ at VGS = 5 V and ID = 5 A. Total power dissipation is rated at 32 W. The component operates within a junction temperature range of -55 °C to +175 °C and is qualified to the AEC-Q101 standard for automotive applications.

Feature Summary

• Dual MOSFET configuration integrated into a single LFPAK56D package
• Automotive qualified to AEC-Q101 standard for high performance applications
• True logic level gate operation with threshold voltage greater than 0.5 V at 175 °C
• Repetitive avalanche rated capability for rugged environments

Applications

• 12 V, 24 V and 48 V Automotive systems
• Motors, lamps and solenoid control
• Transmission control
• Ultra high performance power switching

Procurement Notes

Verify the specific ordering suffix against the manufacturer's official documentation to confirm packaging details such as reel or cut tape specifications. Confirm that the requested part number matches the exact electrical characteristics and thermal ratings defined in the product data sheet. Ensure compatibility with the LFPAK56D footprint during PCB layout verification. Cross-reference the marking code 913410E for physical identification upon receipt.

Selection Notes

Select this component for designs requiring dual isolated channels within a compact surface-mount form factor. The low gate threshold voltage supports direct drive from standard logic interfaces without additional level shifting circuitry. The 175 °C junction temperature rating allows for operation in thermally demanding environments where standard commercial grade devices may fail. Verify that the 159 mΩ on-resistance meets the conduction loss requirements for the intended load current.

Part Context

This device belongs to Nexperia's portfolio of TrenchMOS logic level MOSFETs designed for automotive reliability. The LFPAK56D package provides enhanced thermal performance compared to traditional plastic packages while maintaining a small footprint. The dual configuration allows for bridge topologies or independent control of two loads within a single component, reducing board space and assembly complexity.

Replacement Considerations

Direct replacements must match the 100 V rating, dual channel configuration, and LFPAK56D package. Verify that alternative parts meet the AEC-Q101 qualification if automotive use is required. Check that the replacement's RDS(on) and thermal resistance values are equal to or better than the specified limits to ensure equivalent performance.